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Phoenix nanome|x / microme|x DXR

The phoenix nanome|x is an ultra high-resolution nanofocusX-ray inspection system designed for inspecting high-quality assemblies and interconnections in the semiconductor and SMT industries. The system offers excellent performance and versatility and can be used for 2D X-ray inspection as well as for full 3D computed tomography (nano ct). With the new x|act software package the phoenix nanome|x is the system of choice to ensure meeting actual and future zero defect requirements. Offering up to 30 frames per second, it provides outstanding brilliant live imaging and fast 10 second 3D scans.

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Description

Key Features
  • Superior dual detector technology (digital image chain and active temperature-stabilized digital detector with 30 fps) for brilliant live images
  • High magnification
  • Precise Manipulation
  • High repeatability
  • 180 kV / 15 W high-power open nanofocus tube with up to 200 nanometer detail detectability
  • Upgradeable to nanoCTÒ
  • Optional:
    • x|act software package for easy and fast CAD based high-resolution automated X-ray inspection (μAXI) for extremely high defect coverage with high magnification and repeatability
    • Brilliant live inspection images due to high dynamic temperature-stabilized digital GE DXR detector with 30 fps (frames per second) and active cooling
    • 3D computed tomography scans within 10 seconds
    • Up to 2 times faster data acquisition at the same high image quality level by diamond|window

 

Customer Benefits
  • Combined 2D / 3D CT operation
  • Superior dual detector technology (digital image chain and active temperature-stabilized digital detector with 30 fps) for brilliant live images
  • Automation of inspection steps possible
  • Outstanding ease-of-use
Applications

Mounted Printed Circuit Boards

app-nanomex-semiconductor

nanofocus X-ray image of flip- chip solder joints inside a processor case. The image shows one solder bridge and several open solder joints. The solder joint diameter is app. 150 µm. (Learn More)

Semiconductor and Other Electronic Components

app-micromex-semiconductor-2

nanoCT® of a µBGA after 4000 temperature stress cycles. Due to a voxelsize of 0.5 microns, cracks with 8 to < 1 micron are detectable. (Learn More)

Accessories
  • CT option: includes software datos|x, high precision rotation unit, reconstruction and visualization workstation
  • quality|review: Repair station software for visualizing and manual review of results from an automatic program run, e.g. bga|module, qfp|module or vc|module.
  • converter:Software package to convert result files, generated by quality|assurance or x|act, into other formats, required by third party software.
  • quality|analyst: Software package for analyzing and visualizing inspection results, which are collected by an automatic program and reviewed with quality|review.
  • diamond|window: up to 2 times faster data acquisition at the same high image quality level
  • 4″ Image Intensifier with 4MP Image Chain: This high resolving 4’’ Image Intensifier image chain: with full digital read out and image processing is a basic part for all high quality phoenix|x-ray 2D systems. The detector is suitable for 2D real time inspection.
Specifications
Max. tube voltage 180 kV
Max. output 15 W
Detail detectability Up to 0,2 µm
Min. focus-object-distance 0.3 mm
Max. voxel resolution (depending on object size) < 1 µm 
Geometric magnification (2D) Up to 1970-fold
Geometric magnification (3D) <300-fold
Max. object size (height x diameter) 680 mm x 635 mm / 27″ x 25″
Max. object weight 10 kg/ 22 lbs
Image chain 2 megapixel digital image chain
Manipulation 5-axis sample manipulation
2D X-ray imaging yes
3D computed tomography yes (optional)
System size 1860 mm x 2020 mm x 1920 mm / 73.2” x 79.5” x 75.6”
System weight 2600 kg / 5732 lbs
Radiation Safety – Full protective radiation safety cabinet according to the German RöV (attachment 2 nr. 3) and the US Performance Standard 21 CFR 1020.40 (Cabinet X-ray Systems)
– Radiation leakage rate: < 1.0 µSv/h measured 10 cm from cabinet wall
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2D and USB flash device evaluation with high resolution X-ray inspection and CT German Paper in PLUS 2D and USB flash device evaluation with high resolution X-ray inspection and CT German Paper in PLUS
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